近日，博通推出了3.5D XDSiP（3.5D eXtreme Dimension System in Package）平台 ... 由于该平台同时使用 2.5D 集成和 3D 堆叠，因此博通称其为“3.5D”。

The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.

Hsinchu, Taiwan, Oct 8, 2024 -- Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, and Kiwimoore, a global leader in AI networking full-stack interconnect ...

Over the past ten years, 2.5D integration has proven beneficial ... leading to cost savings and improved package stability. The lead 3.5D XPU integrates four compute dies, one I/O die, and ...

The Synopsys 3DIC Compiler solution provides a unified chip-package co-design and analysis environment for creating an optimal 2.5D/3D multi-die system in a package. The solution includes features ...