As such, the result is a chip that’s flat to the PCB like an SMD component, but with leads that extend much farther out than any traditional package. Obviously, the body of a DIP chip is still ...

Each chip is tested on the wafer. Bad chips are marked for elimination while the good ones are sliced out, placed into packages and connected by tiny wires or solder balls. The package is then ...

SE: What does this mean for Moore’s Law? Iyer: That has been the model for shrinking features in a silicon chip. But if you look at the board and the package, those have not shrunk much in the last 50 ...

For Pentium 4 and Celeron D in LGA775 chip package. Includes Ethernet and HD Audio. 915GL includes graphics and supports 4GB dual channel DDR RAM; 915PL has PCI Express x16 for external graphics ...

The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.

ASU's new R&D facility is a key component of America's plan to bolster semiconductors and high-tech manufacturing.

Some chips may include undeclared milk ingredients, but according to the recall, none were shipped to Kentucky.

Some come with extras like Intel’s newest Wi-Fi technology, Intel Wi-Fi 7, and memory on the package. As with other recent generations of Intel chips, the new lineups have different types of ...