英伟达宣布了一项令人瞩目的技术革新——计划在2025年3月18的GTC（GPU Technology Conference）大会上推出全新的CPO（Chip Package on Board）交换机，并预计在今年8月实现量产。这一消息不仅让科技界为之沸腾，更预示着数据中心和高性能计算领域即将迎来一场深刻的变革。 据说，这款产品可是来头不小，不仅性能强得离谱，还能带动整个光通信产业链往更高规格迈进。

Knowing where circuits came from, and the conditions in which they operate, can help designers optimize devices already in ...

As such, the result is a chip that’s flat to the PCB like an SMD component, but with leads that extend much farther out than any traditional package. Obviously, the body of a DIP chip is still ...

在全球科技巨头英伟达和博通的强烈推动下，台积电的CPO（Chip-on-Package）技术正在快速发展。根据钛媒体3月4日的报道，供应链信息显示，这项前沿技术预计将在2025年下半年开始小规模生产，并计划于2026年正式迎来批量生产。这无疑是对未来AI及5G技术的一次前瞻布局，将为智能设备提供更高效的处理能力与能效。

According to German tech blog WinFuture, Qualcomm's Snapdragon X2 SoCs will ship with up to 18 Oryon V3 cores, which is 50 ...

HONG KONG--China is working on a more than 1 trillion yuan ($143 billion) support package for its semiconductor industry, three sources said, in a major step towards self-sufficiency in chips and ...

TI’s MSPM0C1104 MCU in a WCSP is 38% smaller than the industry’s current smallest MCU, targeting space-constrained devices.

South Korean memory maker SK Hynix saw its exports of multi-chip packages (MCP) fall by nearly 30% sequentially in January 2025. At the same time, some analysts believe that after two years of ...