Researchers in China have developed a quantum processing unit (QPU) that is 1 quadrillion (10¹⁵) times faster than the best ...

Instead of facing up and bonded to the package leads with wires from the outside edges of the chip, any surface area of the flip chip can be used for interconnection, which is typically done ...

In the production process, a die is attached to the frame. Leads are connected to the die using thin wires. “Typically, QFNs are wirebonded, although you can also design them for flip chip,” ...

The Z Flip 7, Z Fold 7 ... Samsung was in the middle of a worrying struggle against inefficient chip production. An unstable 3nm process threatened the availability of Exynos chips, and only ...