Modern package and interposer design has become a system integration task: designers have the responsibility to take input from various stake-holders – who are often designing their content at the ...

Power Integrations reported a two-fold increase in power output from the HiperLCS-2 chipset. Featuring advanced half-bridge switch technology and an innovative package, the new device can deliver up ...

A surge in demand for chips is impacting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, key components, and equipment. Spot shortages in ...

Featuring a SiC primary power switch, this 1,700-V flyback switcher IC is now available in low-creepage, automotive-grade ...

Vishay Intertechnology, Inc. (NYSE: VSH) today announced that it has upgraded its VSOP383xx series of preamplifier circuits for infrared (IR) remote control applications in consumer products with the ...

Power Integrations (NASDAQ: POWI), the leader in high-voltage integrated circuits for energy-efficient power conversion, ...

By employing the established DMP design and PIN layout of the previous ICs, the MLX90425 offers the company's latest magnetic position sensing technology in a legacy package. This provides the ...

Fig.2. Failure analysis methodologies used in IC development (a) (b) [1] JCH Phang, DSH Chan, M. Palaniappan, JM Chin, B. Davis, M Bruce, “A review of Laser Induced Techniques for Microelectronic ...