Modern package and interposer design has become a system integration task: designers have the responsibility to take input from various stake-holders – who are often designing their content at the ...

Advanced assemblies have enabled an unprecedented rate of advancement in the data center, especially for neural processing, ...

Power Integrations reported a two-fold increase in power output from the HiperLCS-2 chipset. Featuring advanced half-bridge switch technology and an innovative package, the new device can deliver up ...

Featuring a SiC primary power switch, this 1,700-V flyback switcher IC is now available in low-creepage, automotive-grade ...

TSMC has notified several Chinese IC design companies that their chips ... US BIS whitelist and proper certification signatures from packaging facilities, leading to suspended shipme ...