The chip industry made significant capital investments this year to build new fabs and facilities or expand existing premises. A number of sites were dedicated to SiC, GaN, DRAM, HBM, along with ...

A new technical paper titled “SRAM and Mixed-Signal Logic With Noise Immunity in 3nm Nano-Sheet Technology” was published by ...

Trump's tech stamp; Chiplet Summit announcements; AI diffusion export concerns; Cadence's security acquisition; chiplets; UMC ...

Wide bandgap materials and advanced packaging are revolutionizing power, but thermal and integration challenges persist.

A new technical paper titled “Computational Assessment of I–V Curves and Tunability of 2D Semiconductor van der Waals ...

GaN is especially well-established in low-power applications like chargers for personal electronics, while silicon and SiC ...

Successfully integrate components like MEMS and sensors by considering every aspect of the device from the outset.

Brewer Science's new co-CEOs talk about shifts in materials for IC manufacturing, flexible substrates, and the uncertainties ...

This enables the EUV lithography era of today, which is likely to continue for the foreseeable future. Initially, EUV became ...

The MEMS & Imaging Sensors Summit demonstrated how collaboration, sustainability, and innovation are driving the sensor ...

The path to fully autonomous vehicles may be clear in concept, but fully realizing that development environment is another ...