Researchers in China have developed a quantum processing unit (QPU) that is 1 quadrillion (10¹⁵) times faster than the best ...

Instead of facing up and bonded to the package leads with wires from the outside edges of the chip, any surface area of the flip chip can be used for interconnection, which is typically done ...

Intel’s "18A" chip-manufacturing process, which promises to turn around the company ... although its first fab in Arizona recently started chip production. On the flip side, the tariffs could be a ...

In the production process, a die is attached to the frame. Leads are connected to the die using thin wires. “Typically, QFNs are wirebonded, although you can also design them for flip chip,” ...