Modern package and interposer design has become a system integration task: designers have the responsibility to take input from various stake-holders – who are often designing their content at the ...

Advanced assemblies have enabled an unprecedented rate of advancement in the data center, especially for neural processing, ...

Featuring a SiC primary power switch, this 1,700-V flyback switcher IC is now available in low-creepage, automotive-grade ...

Power Integrations (NASDAQ: POWI), the leader in high-voltage integrated circuits for energy-efficient power conversion, ...

Toshiba's new gate driver IC for brushed DC motors supports downsizing, low power use, and higher reliability in automotive ...

Power Integrations has announced a two-fold increase in power output from the HiperLCS-2 chipset. Featuring half-bridge switch technology and an innovative new package, the device can deliver up to ...

Power Integrations reported a two-fold increase in power output from the HiperLCS-2 chipset. Featuring advanced half-bridge switch technology and an innovative package, the new device can deliver up ...

Deputy Prime Minister Tran Hong Ha hosted a reception in Hanoi on February 17 for Reha Denemec, Vice President of Türkiye s ...

Offered in the Compact QFN Package, Devices Offer Wider Voltage Range, Enhanced Dark-Ambient Sensitivity, and Improved ...

Safely publish packages, store your packages alongside your code, and share your packages privately with your team.

How can Resolution No. 57-NQ/TW of the Politburo serve as a catalyst for Vietnam’s semiconductor industry to master core technologies? This critical question was thoroughly discussed at the event ...