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Semiconductor Engineering
6 小时
Using AI In Semiconductor Inspection
AI is exceptionally good at spotting anomalies in semiconductor inspection. The challenge is training different models for ...
Semiconductor Engineering
6 小时
Universities Augment Curricula To Boost Engineering Graduates’ Employability
Companies need engineers across all disciplines and universities are stepping up to deliver them; schools reap benefits, too.
Semiconductor Engineering
6 小时
Chiplets: Where Are We Today?
Chuck was also the moderator for the opening plenary session Chiplets: Where We Are Today. The speakers were Jim Handy of ...
Semiconductor Engineering
6 小时
Blog Review: Feb. 5
Keysight’s Richard Duvall highlights the need for rigorous simulation and validation to overcome challenges such as signal ...
Semiconductor Engineering
13 小时
Indium Tungsten Oxide (IWO) Thin-Film Transistors
A new technical paper titled “Thermally Dependent Metastability of Indium-Tungsten-Oxide Thin-Film Transistors” was published by researchers at Rochester Institute of Technology and Corning Research ...
Semiconductor Engineering
15 小时
Optimization of the Inter-Chiplet Interconnect And The Chiplet Placement (ETH Zurich, U. of ...
Placement-based Inter-Chiplet Interconnect Topologies” was published by researchers at ETH Zurich and University of Bologna.
Semiconductor Engineering
1 天
Research Bits: Feb. 4
Researchers from the University of Glasgow, RMIT University, and Princeton University created a new diamond transistor for ...
Semiconductor Engineering
1 天
Indium Nitrate As An Advanced Metal-Oxide Resist for EUV Lithography
A new technical paper titled “Sensitivity and contrast of indium nitrate hydrate resist evaluated by low-energy electron beam ...
Semiconductor Engineering
1 天
Mixed-Precision DL Inference, Co-Designed With HW Accelerator DPU (Intel)
Structured Mixed Precision for Efficient Deep Learning Hardware Codesign” was published by Intel. Abstract “In this paper, we ...
Semiconductor Engineering
1 天
PCIe Over Optics
The benefits and tradeoffs of using optics to move data.
Semiconductor Engineering
1 天
UCIe For 1.6T Interconnects In Next-Gen I/O Chiplets For AI Data Centers
The AI cluster connects to the front-end networks via Ethernet through a network interface card (NIC), which can go up to ...
Semiconductor Engineering
2 天
AI In Data Management Has Limits
Trusting which data to use and what can be deleted still requires human oversight; startups are at a disadvantage.
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