Once they are packaged, the chips inside that package are inaccessible to the tester. With 2.5D, test is less circuitous, which is a key reason why this technology has seen more rapid adoption. Known ...

Defining whether a 2.5D device is a printed circuit board shrunk down to fit into a package, or is a chip that extends beyond the limits of a single die, may seem like hair-splitting semantics, but it ...

Hsinchu, Taiwan -- Sep. 12, 2023-- Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced the launch of its 2.5D/3D advanced package service. With ...

1 The 2.5D Advanced Package I-Cube S technology included in the turnkey solutions, is a heterogeneous integration package technology, with multiple chips in one package to enhance inter-connection ...