Hsinchu, Taiwan -- Sep. 12, 2023-- Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced the launch of its 2.5D/3D advanced package service. With ...

That makes testing essential, but with 3D-ICs there is no simple way to do that. Once they are packaged, the chips inside that package are inaccessible to the tester. With 2.5D, test is less ...

SEOUL, South Korea — July 9, 2024 — Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that it will provide turnkey semiconductor solutions using the 2 ...

Defining whether a 2.5D device is a printed circuit board shrunk down to fit into a package, or is a chip that extends beyond the limits of a single die, may seem like hair-splitting semantics, but it ...

Over the past ten years, 2.5D integration has proven beneficial ... leading to cost savings and improved package stability. The lead 3.5D XPU integrates four compute dies, one I/O die, and ...

Since the platform uses both 2.5D integration and 3D stacking ... Broadcom is set to use its 3.5D eXtreme Dimension System in Package platform for custom AI/HPC processors and ASICs it designs ...