Defining whether a 2.5D device is a printed circuit board shrunk down to fit into a package, or is a chip that extends beyond the limits of a single die, may seem like hair-splitting semantics, but it ...

That makes testing essential, but with 3D-ICs there is no simple way to do that. Once they are packaged, the chips inside that package are inaccessible to the tester. With 2.5D, test is less ...

Hsinchu, Taiwan -- Sep. 12, 2023-- Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced the launch of its 2.5D/3D advanced package service. With ...

SEOUL, South Korea — July 9, 2024 — Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that it will provide turnkey semiconductor solutions using the 2 ...