Modern package and interposer design has become a system integration task: designers have the responsibility to take input from various stake-holders – who are often designing their content at the ...

Advanced assemblies have enabled an unprecedented rate of advancement in the data center, especially for neural processing, ...

Power Integrations, the specialist in high-voltage integrated circuits for energy-efficient power conversion, has announced a ...

Toshiba's new gate driver IC for brushed DC motors supports downsizing, low power use, and higher reliability in automotive ...

Power Integrations reported a two-fold increase in power output from the HiperLCS-2 chipset. Featuring advanced half-bridge switch technology and an innovative package, the new device can deliver up ...

How can Resolution No. 57-NQ/TW of the Politburo serve as a catalyst for Vietnam's semiconductor industry to master core ...

Toshiba Electronic Devices & Storage Corporation ("Toshiba") has started mass production of "TB9103FTG," a gate driver ...

A 650-V bi-directional GaN IC combined with a high-speed isolated gate driver facilitates single-stage power conversion.

This new design allows for improved thermal management by offloading power dissipation to the external PMOS transistors ...

SEALSQ Corp (NASDAQ: LAES) ("SEALSQ" or "Company"), a company that focuses on developing and selling Semiconductors, PKI, and ...

With a 259-foot-long main boom, Tadano’s new five-axle, all-terrain crane offers plenty of reach in a compact package for urban jobsites. Details here ...